COM Express-based technology was developed in 1994 by PICMG, a 250-company consortium that develops open specifications for high-performance computing applications. Today, the COM Express form factor comes in four sizes:
Mini: 55 x 84 mm
Compact: 95 x 95 mm
Basic: 95 x 125 mm
Extended: 110 x 155 mm
These different sizes of COM Express modules help businesses to remain competitive by maximizing the performance of critical infrastructure systems in an increasingly connected world in any conceivable industrial application.
The need for improved performance is evidenced by continuous new product introductions by processor manufacturers such as Intel, AMD, and others. Whether it is better threading, more cores, better graphics, lower power, or higher clock speeds, these companies continuously respond to demand for more and faster computing across the board – whether on the desktop or in embedded industrial systems. But replacing a complete subassembly or subsystem each time a compelling new generation of technology becomes available is time-consuming, expensive, and risky. And yet the need to leverage greater levels of processor power and performance is an imperative. Separating the processor module from the underlying carrier means that technology upgrade is painless and affordable.
refer to:http://industrial-embedded.com/articles/rugged-increasingly-connected-world/
