Challenges to maintain embedded computer

The challenges to maintain the highest embedded computer reliability and availability in rugged embedded system designs will continue, but memory module advancements are set to keep pace with these requirements, helping enable OEMs’ continued competitiveness and future innovation. These advancements solve many design challenges, including low power, enhanced thermal dissipation, and extended-temperature tolerance while delivering the performance needed for today’s complex Embedded Systems. The pin definition leverages a high-performance 240-pin SMT connector system that uses standoffs with screw attachments to firmly hold the XR-DIMM memory module to the motherboard. The systems typically face strict limitations on system height. In addition, these systems require spacing on top of the memory module to enable airflow for effective thermal management. Incorporating a reduced height DDR3L VLP memory module helps improve airflow and provides a low profile, allowing OEMs to offer higher-reliability products that reduce total cost of ownership. Specific embedded system DDR3L VLP modules also offer single refresh rates, which are now essential to maximize performance in high-temperature systems.

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